1. |
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Introduction
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집적회로 공정이란 무엇인가 |
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2. |
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집적회로공정 개요
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집적회로 공정에 대한 전반적인 설명 |
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집적회로공정 개요
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집적회로 공정에 대한 전반적인 설명 |
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3. |
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반도체 공학기초
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1. Dopants
2. Calculation of carrier concentration
3. Mobility and resistance |
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반도체 공학기초
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1. Sheet resistance (Rs)
2. Local oxidation of silicon (LOCOS) |
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4. |
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Isolation과 contact issue
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1. Isolation methods
2. Contacts
3. Process flow of MOSFETs |
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Isolation methods
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1. Local oxidation of silicon (LOCOS)
2. Shallow trench isolation (STI)
3. Thermal oxidation |
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5. |
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Oxidation
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1. Thermal oxidation
2. Properties of thermal SiO2
3. Modeling of thermal oxidation |
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6. |
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Oxidation
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1. Modeling of thermal oxidation
2. Effect of impurities
3. Dopant redistribution |
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7. |
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Oxidation
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Oxide charges |
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Oxidation
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1. Oxidation recipe
2. Oxidation source/method |
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8. |
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Ion implantation
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1. Ion implantation
2. Concentration and dose
3. Energy loss mechanism |
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Ion implantation
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1. Dose vs. concentration
2. Junction depth
3. Sheet resistance of ion implanted layer
4. Ion channeling |
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9. |
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Ion implantation
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1. Ion channeling
2. Implantation damage
3. Dopant activation |
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Diffusion
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1. Dopant diffusion
2. Diffusion mechanisms in Si
3. Diffusion process modeling |
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10. |
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Diffusion
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1. High concentration diffusion effect
2. Oxidation enhanced diffusion (OED)
3. Sheet resistance |
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Gate stack
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1. Gate leakage current
2. Tunneling mechanisms
3. Evaluation of gate dielectric thickness
4. Equivalent oxide thickness (EOT)
5. High-k gate dielectric |
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11. |
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Gate stack
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1. Gate leakage current
2. Tunneling mechanisms
3. Evaluation of gate dielectric thickness
4. Equivalent oxide thickness (EOT)
5. High-k gate dielectric |
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12. |
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Photolithography
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1. Photolithography
2. Photomask layout
3. Photoresist / lift-off
4. Theory of photolithography |
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13. |
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Metallization
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1. Interconnection RC time delay
2. Contact resistance
3. Aluminum metallization |
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14. |
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Metallization
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1. Problems of aluminum metallization
2. Silicide process
3. Surface planarization
4. Damascene process |
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Metallization/Scaling of CMOS
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1. Self-aligned source and drain
2. Lightly doped drain (LDD)
3. Salicide process
4. Scaling trend of CMOS |
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